Lead-free solder paste low U-TEL-702 is directed at a relatively low temperature heat resistant substrate SMT design of a lead-free no-clean solder paste type. Lead-free solder paste low U-TEL-702 melting point of 138 degrees Celsius. A lead-free solder paste low U-TEL-702 Features: 1, wettability, and not dry, printing using a long time, the effect is stable, more effective quality assurance paste 2, easy to operate, printing and rolling off the tin good, just very low squeegee pressure, printing stability, viscosity changes little during continuous printing, no collapse, SMD components are not offset, for as low as 0.3mm pitch pads can complete fine print 3, higher welding performance for nickel plate PCB, hot air, infrared reflow process other four, very little residue after welding, with greater insulation resistance, will not corrode PCB, the board clean, totally Disposable achieve the requirements of 5, can be used for through-hole roller coating process 6, the incorporation of the latest technologies stripping, rubbing net reduction procedure times, improve work efficiency 7, solder full, uniform, climb characteristics 8, Surface high insulation resistance, no internal circuit test question 9, alloy composition containing 42% bismuth, brittle metal bismuth property, so fatigue strength is lead-free low-temperature solder low defects. Second, low-temperature lead-free solder paste U-TEL-702 Scope: SMT substrates for low temperature heat and fatigue strength against less demanding lead-free SMT process electronic products. Third, the lead-free solder paste low U-TEL-702 storage conditions and instructions for use: In the next 5-10 ℃ ambient shelf life of six months, not below 0 ℃ storage conditions, thawed before use 2-4 more than an hour to room temperature before they open to prevent moisture to produce tin beads, then stir well before use. For more information, please visit the official website for gifted Patel: www.vtoxg.com, or call the hotline: 400-8005-703