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- home > Supply > Easy on the tin solder paste manufacturers of lead-free solder paste low temperature solder Shenzhen
Easy on the tin solder paste manufacturers of lead-free solder paste low temperature solder Shenzhen
Information Name: | Easy on the tin solder paste manufacturers of lead-free solder paste low temperature solder Shenzhen |
Published: | 2014-12-30 |
Validity: | 100000000 |
Specifications: | |
Quantity: | 1.00 |
Price Description: | |
Detailed Product Description: | Lead-free solder paste low U-TEL-702 is directed at a relatively low temperature heat resistant substrate SMT design of a lead-free no-clean solder paste type. Lead-free solder paste low U-TEL-702 melting point of 138 degrees Celsius. Tags: Lead-free solder paste low, U-TEL-702 solder paste, Sn42Bi58 a paste, lead-free solder paste low U-TEL-702 Product Features: l wettability, and not dry, printing using a long time, the effect is stable more effective quality assurance paste l easy to operate, printing and rolling off the tin is good, just very low squeegee pressure, printing stability, minimal change in viscosity during continuous printing, no collapse, SMD components are not offset for as low as 0.3mm pitch pads can complete fine print l higher welding performance for nickel plate PCB, hot air, infrared reflow and other residues rarely l after welding process, with more large insulation resistance, will not corrode PCB, the board clean, fully meet the requirements of disposable l vias can be used to roll coating process l incorporation Tuomo latest technology to reduce the rub network operation times, improve work efficiency l solder full, uniform, climb high surface insulation resistance characteristic l, l no internal circuit test problems alloy composition containing 42% bismuth, brittle metal bismuth property, so low fatigue strength is low temperature lead-free solder paste defects. Second, low-temperature lead-free solder paste U-TEL-702 Scope: SMT substrates for low temperature heat and fatigue strength against less demanding lead-free SMT process electronic products. Third, the lead-free solder paste low U-TEL-702 storage conditions and instructions for use: In the next 5-10 ℃ ambient shelf life of six months, not below 0 ℃ storage conditions, thawed before use 2-4 more than an hour to room temperature before they open to prevent moisture to produce tin beads, then stir well before use. Choose Paste? High-quality professional services + + = excellent Ritter paste affordable price to become the "most valuable supplier Paste" mobile phone 18938680221 Shaw determined Ritter excellent features: "the quality of professional services for the development of stable and reflect the value of the" Technical Support: www. u-tel520.com |
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Copyright © GuangDong ICP No. 10089450, Ritter Technology Co., Ltd. Shenzhen gifted All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility
You are the 7769 visitor
Copyright © GuangDong ICP No. 10089450, Ritter Technology Co., Ltd. Shenzhen gifted All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility